Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil

http://repository.vnu.edu.vn/handle/VNU_123/28872

Removal of copper ion (Cu2+) by using surfactant modified laterite (SML) was investigated in the present study.

Characterizations of laterite were examined by X-ray diffraction (XRD), Fourier transforminfrared spectroscopy (FT-IR), inductively coupled plasma mass spectrometry (ICP-MS), and total carbon analysis. 

The optimum conditions for removal of Cu2+ by adsorption using SMLwere systematically studied and found as pH 6, contact time 90 min, adsorbent dosage 5mg/mL, and ionic strength 10mM NaCl.

The equilibrium concentration of copper ions was measured by flame atomic absorption spectrometry (F-AAS).

Surface modification of laterite by anionic surfactant sodium dodecyl sulfate (SDS) induced a significant increase of the removal efficiency of Cu2+. 

The surface modifications of laterite by preadsorption of SDS and sequential adsorption of Cu2+ were also evaluated by XRD and FT-IR.

The adsorption of Cu2+ onto SML increases with increasing NaCl concentration from 1 to 10 mM, but at high salt concentration this trend is reversed because desorption of SDS fromlaterite surface was enhanced by increasing salt concentration.

Experimental results of Cu2+/SML adsorption isotherms at different ionic strengths can be represented well by a two-step adsorption model.

Based on adsorption isotherms, surface charge effects, and surface modification, we suggest that the adsorption mechanism of Cu2+ onto SML was induced by electrostatic attraction between Cu2+ and the negatively charged SML surface and nonelectrostatic interactions between Cu2+ and organic substances in the laterite.

Title: 

	Adsorptive Removal of Copper by Using Surfactant Modified Laterite Soil
Authors:	Pham Tien Duc Nguyen Hoang Hiep Nguyen Ngoc Viet
Keywords:	FIXED-BED COLUMN HEAVY-METAL IONS WASTE-WATER MODIFIED-ALUMINA AQUEOUS-SOLUTION ALPHA-ALUMINA ENVIRONMENT CU(II) DYE NANOPARTICLES
Issue Date:	2017
Publisher:	HINDAWI LTD, ADAM HOUSE, 3RD FLR, 1 FITZROY SQ, LONDON, WIT 5HE, ENGLAND
Citation:	ISIKNOWLEDGE
Abstract:	Removal of copper ion (Cu2+) by using surfactant modified laterite (SML) was investigated in the present study. Characterizations of laterite were examined by X-ray diffraction (XRD), Fourier transforminfrared spectroscopy (FT-IR), inductively coupled plasma mass spectrometry (ICP-MS), and total carbon analysis. The optimum conditions for removal of Cu2+ by adsorption using SMLwere systematically studied and found as pH 6, contact time 90 min, adsorbent dosage 5mg/mL, and ionic strength 10mM NaCl. The equilibrium concentration of copper ions was measured by flame atomic absorption spectrometry (F-AAS). Surface modification of laterite by anionic surfactant sodium dodecyl sulfate (SDS) induced a significant increase of the removal efficiency of Cu2+. The surface modifications of laterite by preadsorption of SDS and sequential adsorption of Cu2+ were also evaluated by XRD and FT-IR. The adsorption of Cu2+ onto SML increases with increasing NaCl concentration from 1 to 10 mM, but at high salt concentration this trend is reversed because desorption of SDS fromlaterite surface was enhanced by increasing salt concentration. Experimental results of Cu2+/SML adsorption isotherms at different ionic strengths can be represented well by a two-step adsorption model. Based on adsorption isotherms, surface charge effects, and surface modification, we suggest that the adsorption mechanism of Cu2+ onto SML was induced by electrostatic attraction between Cu2+ and the negatively charged SML surface and nonelectrostatic interactions between Cu2+ and organic substances in the laterite.
Description:	TNS07018 ; JOURNAL OF CHEMISTRY Article Number: 1986071 Published: 2017
URI:	http://repository.vnu.edu.vn/handle/VNU_123/28872
ISSN:	2090-9063 2090-9063
Appears in Collections:	Bài báo của ĐHQGHN trong Web of Science